![[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3](https://image.mono.ipros.com/public/product/image/2001540799/IPROS13312181139695781877.png?w=280&h=280)
[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3
Room temperature curing × High thermal conductivity 3.3W/mK × Flexibility! An epoxy resin suitable for stress relief. Ideal for gap filler applications, flame retardant equivalent to V-0.
The TE-7172K3 is a two-component, room-temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It can cure at 25°C without the need for heating equipment, making it energy-efficient and adaptable to flexible production processes. Its most notable feature is its high thermal conductivity of 3.3 W/m·K, which is effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb stress and prevent cracking in substrates and modules. The cured material exhibits balanced properties with a glass transition temperature of -20°C, a coefficient of linear expansion of 24 ppm/K, and a Shore D hardness of 45, combining heat resistance and flexibility. Moreover, it has flame retardant properties (equivalent to UL94 V-0 at 5mm thickness), making it safe for use in electronic devices that require safety. This improved version enhances heat resistance and toughness while inheriting the features of the conventional TE-7172K2. Applications include gap fillers, heat dissipation insulation materials, and encapsulation of electronic components where stress relief is required.
- Company：寺田
- Price：Other
![[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2](https://image.mono.ipros.com/public/product/image/2001540795/IPROS14340940884324687877.png?w=280&h=280)
